Tag: HDI PCB

Published: June 21, 2026 | Category: UAV Avionics | Reading time: 6 minAs UAV platforms shrink from group-3 tactical systems to nano-class surveillance drones, the flight controller core PCB must compress an entire avionics suite — processor, memory,

From 4-layer GNSS tracker boards to 12-layer ADAS camera HDI stacks, Superb Automation fabricates PCBs for telematics, vehicle electronics, and industrial IoT. Our PCB capabilities cover the full range: Rogers RF laminates for GPS/cellular front-ends

High-Density Interconnect (HDI) PCBs use laser-drilled micro-vias — as small as 0.05 mm — to connect layers at far higher density than conventional through-hole vias. Superb Automation manufactures HDI boards up to 30-layer ELIC (Every Layer Intercon

Superb Automation operates PCB manufacturing facilities in Wuxi and Huizhou, supporting high-mix, high-complexity PCB production from prototype to volume. Combined monthly capacity exceeds 2.05 million sq.ft. (850K Wuxi + 1,200K Huizhou), expanding t

20 Mitsubishi laser drills (5Z00U & ML605GTW5) for micro-via processing. Hole sizes down to 0.1mm for any-layer HDI. High-volume throughput for smartphones, ADAS, and 5G base stations.

8-layer 2-step HDI · 6.52 × 5.21 mm · 0.75 ± 0.08 mm · ENIG · Resin plug · Stacked laser via · White solder mask · 75 μm solder bridge · SMT assembly · Build-to-print from Gerber

Medical Electronics Manufacturing: Trends, Regulations, and OpportunitiesHow portable medical devices, AI diagnostics, and regulatory requirements are shaping the medical PCBA industry.Portable and Wearable Medical Devices Drive PCB InnovationThe med

Bluetooth Module Carrier Board — RO4350B, 4L 1-Step HDI4-layer 1-step HDI · Rogers RO4350B · 0.55 mm · 14 × 21 mm · ENEPIG · Bluetooth 2.4 GHz ISM · Build-to-print from GerberProduct SpecificationsParameterValueProduct typeBluetooth module carrier bo

Superb Automation یک تولیدکننده حرفه‌ای PCB در شنژن چین است. ما بردهای مدار چاپی چند لایه، HDI، فرکانس بالا (RF) و سرعت بالا را با استاندارد IPC-A-600 کلاس ۳ تولید می‌کنیم. مشتریان ما در ایران — از شرکت‌های هوافضا گرفته تا تولیدکنندگان پهپاد FPV، تجه

Advanced HDI (High-Density Interconnect) extends beyond standard multi-layer PCB fabrication by incorporating laser-drilled micro-vias, sequential lamination build-up layers, and fine-line trace/space geometries below 4/4 mil. Where a standard throug

High-Density Interconnect (HDI) PCB technology uses laser-drilled micro-vias — typically 0.1–0.15 mm in diameter — to connect layers at far higher density than traditional through-hole vias. Originally developed for smartphone miniaturization, HDI is

PCBs for AI Large Model Training: From GPU Accelerator Cards to Power DistributionPublished: June 21, 2026 • Category: AI Compute • Reading Time: 18 minTable of ContentsIntroduction: The PCB Backbone of AI TrainingGPU Accelerator Card PCBsNVLink Inte

18-Layer 2nd-Order HDI · 2oz Thick Copper · TU883 · 2.6mm · ENIG; High-Current Power Distribution Backplane

Compact, low-power PCB assembly for smart sensors, wearables, connected home devices, and battery-operated IoT endpoints — optimized for miniaturization and energy efficiency.